Xilinx has disclosed the company is working with Taiwan Semiconductor Manufacturing Company (TSMC) on the 7nm process and 3D IC technology for its next generation of all programmable FPGAs, multiprocessor system-on-chips (MPSoCs) and 3D ICs.

Xilinx plans to introduce new 7nm products in 2017, according to the company.

"TSMC has been the foundation of our success at 28nm, 20nm, and 16nm, what we call our 3Peat," said Xilinx president and CEO Moshe Gavrielov in a statement. "Their outstanding process technology, 3D stacking technology, and foundry services have enabled Xilinx to build an unparalleled reputation for product excellence, quality, execution, and market leadership. They have also helped Xilinx transform its product portfolio with a new generation of SoCs, MPSoCs and 3D ICs, complementing its world class FPGAs. We believe TSMC's 7nm technology will be even more transformative for Xilinx."