DRAM maker Rexchip Electronics plans to allocate NT$4 billion (US$133 million) for its capex next year, down from NT$12.8 billion in 2010, according to the company. As most of its equipment purchases completed this year, Rexchip said capex for 2011 will be mainly utilized for converting part of its capacity to 30nm-class process technology as well as spending on R&D.
Rexchip revealed that initially it will transfer only half of its capacity to the 3Xnm node in 2011, and further conversion will depend on market conditions.
Rexchip noted that by the end of December 2010, all of its capacity will be transfered to a 45nm process. It now runs a 12-inch fab capable of producing about 80,000 wafer starts a month.
Rexchip has installed five sets of immersion lithography equipment, a key tool for ramping production on sub-50nm processes. The company is schedule to enter mass production of 2Gb chips using 45nm process technology in February 2011, allowing it to bring down the production cost to US$1.50-1.60 from US$1.80-2 currently.
According to DRAMeXchange, spot prices for 2Gb DDR3 memory closed up 0.74% to average US$2.04 on December 13.