Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package) modules from Apple for 2016.

JCET will be a new contract provider of SiP assembly services for Apple, adding to the existing suppliers including Japan's Murata and Universal Scientific Industrial (USI) of Taiwan-based Advanced Semiconductor Engineering (ASE), according to industry sources. STATS ChipPAC, which was acquired by JCET earlier in 2015, already has its Korea-based operation obtain certification from Apple, said the sources.

In addition, JCET's board of directors has approved plans to spend a total of US$200 million to expand production lines for SiP modules, the sources indicated.

JCET's manufacturing facilities are located in the Jiangsu and Anhui provinces in China. JCET also has a subsidiary named Jiangyin Changdian Advanced Packaging (JCAP) which specializes in advanced wafer bump technology and wafer-level chip scale packaging. JCAP's facilities are located in Jiangyin, Jiangsu province.