Handset chipset solution vendors, including Qualcomm, MediaTek and Spreadtrum Communications are likely to focus on promoting peripheral chips such as fast/wireless charging chips, fingerprint sensors, dual-lens modules and 3D-enabled chips in 2016 as smartphone vendors will try to increase the value-added of their models in order to ramp up sales, according to industry sources.

Profits generated from mainstream IC solutions including application processors and modems are unlikely to grow significantly in 2016 due to fierce competition among vendors as well as to high penetration rates of these chips, said sources.

On the other hand, demand for fast/wireless charging chips, fingerprint and force touch sensors, 3D-enabled display chips and dual-lens modules is expected to heat up in 2016 as smartphone vendors will add more innovative applications to differentiate their products, commented the sources.

Additionally, deployments in peripheral chips will also help the main chipset solution vendors maintain the competitiveness of chipset platforms, added the sources.