TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of TSMC customers adopting the technology, the Chinese-language Commercial Times cited a Goldman Sachs analyst as saying in a recent report.

TSMC will have 85,000-100,000 wafers fabricated with the foundry's in-house developed InFo packaging technology in the second quarter of 2016, the report quoted Goldman Sachs analyst Donald Lu as estimating.

TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan. TSMC's InFo technology will be ready for volume production in the second quarter of 2016, according to Wei.

TSMC expects quarterly sales generated from its backend InFO technology to exceed US$100 million by the end of 2016, said Wei.

Also at the investors meeting in October, TSMC president and co-CEO Mark Liu disclosed the company is working on the second generation of its InFO technology for several projects on 10nm and 7nm process nodes.