Chip suppliers of Apple's next-generation iPhone-series have started to book production capacity at their foundry and backend partners, according to industry sources.

Chip suppliers including Cirrus Logic and Analog Devices (ADI) have recently requested their foundry and backend service providers reserve a significant portion of their production capacities in the second and third quarters, said the sources.

Cirrus Logic and ADI are both among the major IC providers of Apple, and reportedly will play a key role in the brand new design for upcoming iPhone 7 series which will be slimmer than existing iPhone models without a 3.5mm headphone jack. ADI will offer driver components for a dual-lens design for the model, the sources noted.

In addition, TSMC is expected to grab most of or probably all orders for Apple's A10 processors which will be featured in the iPhone 7 series, the sources indicated. The foundry has been aggressively expanding its 16nm FinFET process production capacity, and is set to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.