Taiwan Semiconductor Manufacturing Company's (TSMC) monthly output capacity on its 16nm process technology will grow to 80,000 12-inch wafers later in March from 40,000 units in February, according to a recent Chinese-language Economic Daily News (EDN) report.

The upcoming ramp-up of 16nm production capacity will buoy TSMC's sales performance starting March, the report quoted market watchers as indicating.

TSMC co-CEO CC Wei remarked at the company's most recent investors meeting that TSMC's share of the 14/16nm foundry market segment will rise above 70% in 2016 from around 40% in 2015. The foundry's 16nm FinFET processes consisting of 16FF (16nm FinFET), 16FF+ (16nm FinFET Plus) and 16FFC (16nm FinFET Compact) will generate more than 20% of its total wafer revenues in 2016.

Apple, Xilinx, MediaTek, HiSilicon, Spreadtrum and Nvidia are reportedly among TSMC's major 16nm customers.