Despite postponed deliveries of some chips from its foundry, MediaTek is expected to meet its sales guidance for the first quarter of 2016, according to industry sources.

Shipments of MediaTek's MT6625-series wireless connectivity chips have been affected by TSMC's wafer delivery delays caused by an earthquake that hit southern Taiwan on February 6, the sources indicated. The MT6625 is MediaTek's major connectivity product integrating four advanced radio technologies.

MediaTek's MT6625 4-in-1 connectivity chip is being manufactured at TSMC's Fab 14 located at the Tainan Science Park, and is among the products most affected by damaged wafers at the foundry due to the earthquake, the sources said.

TSMC is striving to recover its lost production for MediaTek, which should be able to have first-quarter revenues meet the company's guidance of NT$52.5-NT$57.4 billion.

TSMC has disclosed that the earthquake interrupted its production at Fab 6, 14A and 14B. For Fab 14A, wafer delivery will be delayed by 10 to 50 days, and delivery of about 100,000 12-inch wafers will be delayed from the first quarter to the second quarter. For Fab 6, the wafer delivery delay is five to 20 days, with 20,000 8-inch wafers delayed to the second quarter. For Fab 14B, the delivery delay is negligible.