ARM and TSMC have announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs.

The new agreement expands the companies' long-standing partnership and advances leading-edge process technologies beyond mobile and into next-generation networks and data centers. Additionally, the agreement extends previous collaborations on 16nm and 10nm FinFET that have featured ARM's Artisan Physical IP.

Customers designing their next generation high-performance computing SoCs will benefit from TSMC's industry-leading 7nm FinFET, which will deliver more performance improvement at the same power or lower power at the same performance as compared to our 10nm FinFET process node, according to Cliff Hou, R&D vice president, TSMC.