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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
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SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2010-02-01
Samsung announces 2Gb DDR3 using 30nm-class technology
2010-02-01
Winbond president announces entrance into 40nm war
2010-01-29
iPad Stimulates Demand for NAND Flash
2010-01-29
Memory backend firm Walton sees influx of DDR3 orders
2010-01-29
NOR flash maker Macronix to hike salaries by 10% in 2010
2010-01-28
Macronix sees profit growth in 4Q09; NOR flash sales up
2010-01-28
Elpida sees first net profits in nine quarters
2010-01-28
Memory module makers to see flat revenues in January despite DRAM price drop
2010-01-27
Inotera to raise NT$25 billion through syndicated loan
2010-01-27
Phison upbeat about 1Q10 thanks to Toshiba orders
2010-01-26
High-density NAND flash prices rise by up to 3% in 2H January
2010-01-26
DRAM contract prices flat in 2H January
2010-01-26
PSC dismisses report on Rexchip shares buyback
2010-01-25
Taiwan DRAM makers see delays in immersion litho delivery
2010-01-25
SSD market to grow at 54% CAGR by 2013, says IDC

 

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Update: 07-10 23:22,Data has delay
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