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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2017-04-18
Apple prepares iMac upgrades for 2H17 and high-end iMac for end of 2017
2017-04-18
Quanta to stay top AIO PC maker in 2017
2017-04-18
Intel Cancels Intel Developer Forum, Including IDF17
2017-04-17
UMC Xiamen fab obtains orders from MediaTek, Spreadtrum
2017-04-17
28nm to be SMIC growth driver in 2017
2017-04-17
DDR4 set to account for largest share of DRAM market by architecture, says IC Insights
2017-04-17
Gartner raises 2017 chip market outlook to 12% growth
2017-04-17
ChinaFlashMarket will suspend HK market quotation on 17 April
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TSMC confirms it is not bidding for Toshiba memory-chip unit
2017-04-14
IDC, Gartner see different trends for 1Q17 PC shipments
2017-04-14
Asustek ships 4.2 million notebooks in 1Q17, say sources
2017-04-14
TSMC cuts foundry growth outlook for 2017
2017-04-14
Xiaomi Mi Note 3 To Be Announced In 2Q17
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Update: 11-07 23:47,Data has delay
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