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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2010-05-07
Chip industry set for highest annual growth in 10 years
2010-05-06
Inotera buys equipment from ASML
2010-05-05
PC component makers increasing quotes to handle rising copper prices
2010-05-05
DRAM revenues grow 7% on quarter in 1Q10
2010-05-05
DRAM market recovers to end 2009 in triumph
2010-05-04
Memory chip designer Etron swings to profits in 1Q10
2010-05-04
PSC sees April revenues up on month, but Nanya down
2010-04-30
Supply of NOR flash MCP solutions to remain tight despite Samsung PRAM launch
2010-04-29
NOR flash supply to remain tight until mid-2011
2010-04-29
Samsung develops world's first PRAM for mobile phones
2010-04-29
The iPad and iPhone will create NAND Flash shortage
2010-04-28
Macronix approves NT$16.4 billion for capacity expansion
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Winbond posts profits for second straight quarter
2010-04-27
Phison cautious about short-term NAND flash outlook
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DRAM maker ProMOS to slash capital 65%

 

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Update: 07-09 07:04,Data has delay
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