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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
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2011-06-22
Elpida develops 4-layer DRAM package with 0.8mm thickness
2011-06-21
Samsung Pays $150 Million To Spansion In Settlement (CODE)
2011-06-21
Rambus, Hynix, Micron alleged complicity monopoly claims $ 12.9 billion
2011-06-21
Elpida, Micron reportedly in talks on DRAM partnership
2011-06-20
NAND flash contract prices for 1H June still being negotiated
2011-06-20
Sharper DRAM price cuts ahead
2011-06-17
Elpida shifts partial capacity back to PC DRAM
2011-06-16
ProMOS diversifying away from PC DRAM
2011-06-15
Nanya turning focus away from PC DRAM
2011-06-15
Elpida uses HKMG technology to develop 2Gb LPDDR2
2011-06-15
Mobile DRAM oversupply concerns raised
2011-06-14
DRAM contract prices face continuing downward pressure
2011-06-13
Powerchip eyeing 2Q11 break-even, says chairman
2011-06-13
Winbond to outsource Mobile RAM chips to Powerchip
2011-06-10
Weak channel demand prompts memory module houses launch big price cut, says inSpectrum

 

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Update: 11-12 02:26,Data has delay
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