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Samsung secures AMD contract for HBM3E 12-stack, clears defect concerns　 25/06/16
The HBM3E used in the MI350 series is believed to be Samsung’s 36GB 12-layer DRAM, completed last year. The chip vertically stacks 24Gb DRAM dies using through-silicon sia (TSV) technology, offering 36GB per package.
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SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business 　 25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
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2016-08-24
China mobile AP shipments increase 8% in 2Q16
2016-08-24
Apple Planning Three 2017 iPhone Models, One Has Curved Display
2016-08-24
Samsung, Apple Generate Vast Majority Of Global Smartphone Profits
2016-08-24
Qualcomm to extend lead in smartphone AP market
2016-08-24
TSMC 28nm utilization rate to fall on slowdown in Intel orders
2016-08-24
Samsung W2017 Clamshell Now Spotted Running Snapdragon 820
2016-08-23
Acer, Asustek, Samsung preparing to showcase new wearables at IFA 2016, says paper
2016-08-23
Lenovo shifts component orders back to Taiwan makers
2016-08-23
Gionee S6s Officially Announced, Available Only In India
2016-08-23
Samsung Working On High-End Tizen-Based Smartphone
2016-08-23
Samsung To Sell Refurbished Phones In 2017
2016-08-23
Samsung Z2 Now Official In India, Costs Only $70
2016-08-23
PCI-Express 4.0 Pushes 16 GT/s per Lane, 300W Slot Power
2016-08-22
Winbond flash chip adopted in Samsung Galaxy Note 7, says report
2016-08-22
After successive decline for 2 quarters, India smartphone market recovers with 17% growth in 2Q16, says IDC

 
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Update: 06-16 18:20,Data has delay
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SK Hynix KRW 248000 +5.31%
KIOXIA JPY 2009 -0.05%
Micron USD 115.600 -0.50%
WDC USD 55.700 -0.14%
SanDisk USD 42.500 +2.91%
Nanya TWD 52.9 -1.12%
Winbond TWD 18.40 -0.27%
Phison TWD 531 +0.95%
SMI USD 66.960 -0.76%
Maxio CNY 37.48 +0.19%
ASolid TWD 56.2 -1.40%
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PENG USD 19.280 -3.79%
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