Recommended Hot News
SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal  25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business   25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
SK hynix's US sales make up over 70% in Q1 on rising AI demand  25/05/16
Chip giant SK hynix has reported that its U.S. sales accounted for over 70 percent of its total revenue in the first quarter on rising demand for premium high bandwidth memory (HBM) chips from major U.S. tech companies.
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2024-12-09
Samsung Completes Development of Groundbreaking 400-layer NAND Technology
2024-12-09
CXL Consortium Announces Compute Express Link 3.2 Specification Release
2024-12-06
SK Hynix beefs up executive team amid high number of promotions
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Korea’s Nov. exports up 1.4% on solid chip demand
2024-11-26
Samsung succeeds in reducing use of PR during 3D NAND lithography
2024-11-25
Nvidia CEO signals Samsung’s imminent shipment of HBM3E
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Tesla asks Samsung, SK Hynix to supply HBM4 chip samples
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Samsung Electronics Expands Packaging Facilities in Suzhou
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Samsung Electronics to expand chip packaging facilities for HBM
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KIOXIA invests $230 million to develop CXL power-saving memory for AI
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Samsung Electronics' Pingze P4 plans to simultaneously mass produce NAND and DRAM
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2024-11-05
SK Hynix to provide HBM3E 16H samples in early 2025
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Samsung Semiconductor's profit decreased by 40% month on month, with plans to normalize inventory levels by the end of the year
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SK Hynix reportedly considers establishing a dedicated HBM business unit

 

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