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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2013-04-19
Chipmaker TSMC gets tablet, smartphone boost in 1Q
2013-04-19
AMD results beat expectations in declining PC market
2013-04-19
Samsung says the Galaxy S4 might use Hynix DRAM
2013-04-19
ASE, SPIL 2Q13 sales outlook optimistic
2013-04-19
ChipMOS sees orders for NAND flash, driver ICs pick up
2013-04-19
Samsung to launch Galaxy S4 at end of April in 50 countries
2013-04-19
Companies gearing up for USB 3.0 hub market boom
2013-04-19
NAND memory market rockets
2013-04-19
Smartphones will use 26% of NAND flash in 2013
2013-04-18
Brazil launches 4G wireless service with few smartphone options
2013-04-18
Apple reportedly stops placing Mac component orders
2013-04-18
Asustek Computer's 1Q Notebook Shipments up 15% on Year
2013-04-18
Foxconn to pay Microsoft for production of Android/Chrome devices
2013-04-17
iPad mini shipments expected to drop as high as 30% in 2Q13
2013-04-17
Memory makers see better profits as chip pricing improves

 

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