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SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal　 25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business 　 25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
SK hynix's US sales make up over 70% in Q1 on rising AI demand　 25/05/16
Chip giant SK hynix has reported that its U.S. sales accounted for over 70 percent of its total revenue in the first quarter on rising demand for premium high bandwidth memory (HBM) chips from major U.S. tech companies.
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2018-10-30
Intel to outsource entry-level processor, chipset production
2018-10-30
Tight supply of notebook MLCCs loosening on Intel CPU shortfall
2018-10-29
GLOBALFOUNDRIES and Chengdu Realign Joint Venture Strategy
2018-10-26
Xiaomi smartphone shipments to hit a milestone by October
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MediaTek unveils Helio P70 bringing AI to mid-range devices
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NAND flash prices may see larger drop in 2019
2018-10-23
Samsung, SK Hynix stepping up DRAM EUV technology R&D
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Chipmakers keen to expand 5G offerings beyond smartphones
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TSMC expects 7nm chip sales to account for 10% of 2018 revenues
2018-10-18
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2018-10-17
MediaTek to roll out 12nm Helio P70 mobile chip in October
2018-10-17
Nanya cuts capex outlook
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