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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
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SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2011-04-12
Fresco 2-port USB 3.0 host controllers now USB-IF certified
2011-04-12
MediaTek begins marketing EDGE-enabled MT6236 solution
2011-04-11
Memory module firms enjoy rebound in March revenues
2011-04-11
MediaTek 1Q11 revenues down 12% sequentially
2011-04-08
Flash card maker Hagiwara files for bankruptcy protection
2011-04-08
Elpida says packaging and testing unit affected by earthquake
2011-04-08
DRAM contract price rebounds on supply concerns
2011-04-07
7.4 magnitude quake hits Japan, tsunami warning issues for northeast
2011-04-07
Elpida develops 30nm, 4Gb DDR2 mobile RAM
2011-04-07
MediaTek 3Q11 sales to show substantial rebound, says president
2011-04-07
Adata March revenues up 53% on-month
2011-04-07
DRAM makers March revenues up on-month
2011-04-06
IHS iSuppli raises semiconductor forecast for 2011
2011-04-06
Toshiba announces 24nm, ECC-integrated NAND chip
2011-04-06
TI to acquire National Semiconductor for US$6.5 billion

 

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