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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
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SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2011-07-18
Apple Will Begin Purchase Chips In August
2011-07-18
Nanya, Inotera to post another quarter of losses
2011-07-15
Imec reports breakthroughs in DRAM, RRAM
2011-07-15
JMicron lands USB 3.0 chip orders from Samsung
2011-07-15
ChipMOS mulls phasing out DRAM backend business
2011-07-14
DRAM contract prices fall 7% in 1H July
2011-07-14
Samsung said to ramp new fab in September
2011-07-13
Hynix, Toshiba to jointly develop MRAM
2011-07-13
Taiwan DRAM makers mull production cuts
2011-07-12
Elpida to launch rights issue, CB for JPY79.7 billion
2011-07-11
Elpida to raise $990 million for new chips
2011-07-08
DDR2 spot price rebounds
2011-07-08
NAND flash prices to stabilize in 3Q11, says Phison chairman
2011-07-07
DRAM backend firms post slight growth in June revenues
2011-07-07
ProMOS to downsize capital by 85%

 

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Update: 07-06 12:01,Data has delay
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