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Micron Announces DDR4 Sunset Amid Stronger?Than?Ever Demand  25/06/16
In a recent interview, Micron's Executive Vice President and Chief Business Officer, Sumit Sadana, acknowledged that the phase?out comes at a time when demand for DDR4 remains unexpectedly strong. He noted that shortages of both DDR4 and LPDDR4 modules have driven spot-market prices to levels that, in some cases, exceed those of newer DDR5 products.
Samsung secures AMD contract for HBM3E 12-stack, clears defect concerns  25/06/16
The HBM3E used in the MI350 series is believed to be Samsung’s 36GB 12-layer DRAM, completed last year. The chip vertically stacks 24Gb DRAM dies using through-silicon sia (TSV) technology, offering 36GB per package.
SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal  25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
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Update: 06-20 12:17,Data has delay
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