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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2014-02-27
BOE to expand production capacity for small- to medium-size panels
2014-02-27
China handset vendors to rely on local AMOLED panel production from 2016
2014-02-27
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2014-02-27
MWC 2014: BlackBerry unveils Z3, Q20 smartphones
2014-02-27
MWC 2014: Huawei ushers in new LTE devices
2014-02-27
Sony Electronics to close 20 US stores affecting 1,000 employees
2014-02-27
Dell to enter home entertainment market via AlienWare
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MWC 2014: Qualcomm optimistic about 4G smartphone market
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Moto X To Launch In India And Australia Within The "Next Few Weeks"
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Samsung Announces Exynos Octa 5422 and Exynos Hexa 5260 SoCs
2014-02-26
Global Mobile NAND Flash Memory Market 2014 Report With Forecasts to 2018
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TSMC remains key foundry partner for 28nm chips, says MediaTek

 

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Update: 11-13 19:02,Data has delay
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