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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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To view news
2011-06-01
DRAM market falls short of expectations in 1Q11
2011-05-31
PTI, Elpida, UMC to collaborate to develop 3D IC logic+DRAM integration solution
2011-05-31
ProMOS shifting focus away from PC DRAM
2011-05-30
Rexchip to post another quarter of profits
2011-05-30
Global DRAM module market to grow almost 11% in 2011
2011-05-27
Rexchip revises 2011 capex
2011-05-26
DRAM contract prices flat in 2H May
2011-05-26
Taiwan DRAM makers to ramp 30nm-class production in 2H11
2011-05-25
Memory module makers see weak sales in May
2011-05-24
Windows 8 on ARM expected to appear by the end of 2011
2011-05-20
MediaTek, MStar reiterate sales guidance for 2Q11
2011-05-20
Another quiet week in DRAM, NAND flash spot markets
2011-05-19
NAND flash prices drop due to oversupply
2011-05-18
ASMedia USB 3.0 host controllers secures USB-IF certification
2011-05-17
NAND flash contract prices slip further in 1H May

 

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Update: 11-18 02:56,Data has delay
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