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SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal　 25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business 　 25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
SK hynix's US sales make up over 70% in Q1 on rising AI demand　 25/05/16
Chip giant SK hynix has reported that its U.S. sales accounted for over 70 percent of its total revenue in the first quarter on rising demand for premium high bandwidth memory (HBM) chips from major U.S. tech companies.
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2018-05-11
SMIC to start risk production of 14nm FinFET process in 1H19
2018-05-11
Powerchip to build new 12-inch wafer fab
2018-05-10
TSMC April revenues down 21% on month
2018-05-10
China's ZTE Halts Major Operations After U.S. Severed Supply
2018-05-10
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2018-05-10
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2018-05-09
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China smartphone AP shipments to increase 17% in 2Q18
2018-05-07
Foxconn mulls 12-inch fab construction
2018-05-07
ZTE petitions US government to lift sanctions
2018-05-04
China smartphone shipments fall below 90 million units in 1Q18
2018-05-04
Global notebook shipments to fall 5.3% in 2Q18
2018-05-04
TSMC to Bring 3D Stacked Wafers to Complex Silicon Designs, Such as GPUs
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Xiaomi officially files for Hong Kong IPO to raise a reported $10 billion
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Nearly 50% of new smartphones launched by China makers by year-end 2018 to come with AI applications

 
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Update: 06-15 00:11,Data has delay
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