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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2010-01-18
APCB expects 30% growth in 2010 on PCB demand from notebook segment
2010-01-18
PSC to offer cash compensation to encourage conversion of ECB into shares
2010-01-15
Global PC market leaps back to double-digit growth in 4Q09, says IDC
2010-01-15
DDR3 spot price continues growing, says inSpectrum
2010-01-15
Taiwan DRAM makers shifting capacity to DDR3 chips
2010-01-14
IC distributor GMI revenues to grow 25-30% in 2010
2010-01-14
Kingston reportedly pays US$100 million for memory chips to Hynix
2010-01-14
Samsung uses 30-nm NAND flash for mobile memories
2010-01-14
Memory controller maker JMicron eyes 100 million in 2010 shipments
2010-01-13
Taiwan market: Vibo offers own-brand Android smartphones
2010-01-13
Japan chip-gear sales to grow 38% in FY 2010, says SEAJ
2010-01-13
DDR3 contract prices rise in 1H January, DDR2 stays flat
2010-01-13
Hynix intros 2Gb DDR2 for mobile applications
2010-01-12
Rexchip ramping DDR3 output
2010-01-11
NAND flash demand slow in early January

 

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Update: 07-10 23:22,Data has delay
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