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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2013-04-23
Smaller Windows 8 tablets will be huge
2013-04-23
Demand for 64Gb NAND flash chips stays strong
2013-04-23
Lenovo seeking help from Taiwan ODMs for the server industry
2013-04-22
Intel pushing adaptive all-in-one PCs with new components
2013-04-22
ChipMOS subsidiary begins trading on Taiwan emerging stock board
2013-04-22
Compal lands orders for 10-inch tablet from Acer
2013-04-22
Taiwan ODM factories in western China unaffected by earthquake
2013-04-22
Microsoft's Surface tablet sells more units than Google's Nexus 10, still behind the Apple iPad
2013-04-22
Apple returned 8M shoddy iPhones to Foxconn
2013-04-22
Lenovo Considers Taking Over IBM X86 Server Business
2013-04-19
Intel promotes Android convertible notebooks
2013-04-19
Startup offers USB 3.0 PHY IP on TSMC 40nm
2013-04-19
Asustek to launch own-brand SSDs
2013-04-19
Mobile devices, SSDs propelling NAND flash sales in 2013
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ASMedia to move 85nm chips to mass production in 2H13

 

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