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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
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2011-01-07
Rexchip reportedly resumes shipments to Powerchip
2011-01-07
Macronix 4Q10 revenues below guidance
2011-01-06
New Transcend USB 3.0 flash drive uses Innostor controller
2011-01-06
Adata revenues rebound in December
2011-01-06
DRAM supply to be 28% more than demand in 2011
2011-01-05
Elpida reportedly cuts substantial GDDR orders to Winbond
2011-01-05
DRAM prices collapsing
2011-01-05
New Micron SSD uses 25nm NAND with capacities up to 512GB
2011-01-05
Samsung develops DDR4 module built using 30nm technology
2011-01-04
Powerchip says unable to pay Rexchip bills
2010-12-30
Micron reportedly taps Phison, Skymedi for eMMC NAND
2010-12-29
NAND flash contract prices flat in 2H December
2010-12-28
Apacer diversifying away from standard memory modules
2010-12-28
ProMOS to make own-brand DRAM using Elpida design
2010-12-28
ProMOS, Powerchip claim no knowledge of reported DRAM tie-up with Elpida

 

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Update: 11-19 03:41,Data has delay
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SK Hynix KRW 570000 -5.94%
KIOXIA JPY 10260 -8.11%
Micron USD 232.430 -3.93%
WDC USD 155.000 -4.59%
SanDisk USD 249.910 -6.01%
Nanya TWD 160.5 -3.60%
Winbond TWD 61.4 -7.25%
Phison TWD 1195 -7.36%
SMI USD 85.335 -0.16%
Maxio CNY 49.88 -0.83%
ASolid TWD 71.0 -6.58%
Longsys CNY 271.03 -5.80%
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