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According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
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SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2017-02-27
Samsung Confirms Galaxy S8 Launch Date, Releases New Teaser Video
2017-02-27
Motorola Announces Five New Moto Mods, Amazon Alexa Also Coming To The Moto Z
2017-02-24
MWC 2017 set for a new round of competition for smartphones
2017-02-24
TSMC on track to move 5nm to risk production in 1H19
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Samsung Galaxy S8 Reportedly Goes On Sale April 21
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Xiaomi's Pinecone Chipset Detailed, Two Variants To Be Announced On February 28
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Qualcomm begins comeback fight against Korean FTC
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HTC aims high while LG look low in India smartphone market
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Samsung Might Sell Refurbished Galaxy Note 7 Units
2017-02-22
Honor V9 Launches In China, Starts At $380
2017-02-22
Qualcomm Unveils X20 Gigabit Modem
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