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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
Samsung Electronics Supplies SSDs for Nvidia’s DGX Spark Supercomputer  25/10/29
The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2013-02-28
Why it's time to upgrade to an SSD in Singapore
2013-02-27
MWC 2013: Asustek announces Fonepad priced at US$249
2013-02-27
MWC 2013: China Mobile unveils 4 TD-LTE smartphones
2013-02-27
MWC 2013: Qualcomm, MediaTek not ready to develop 8-core smartphone CPUs
2013-02-27
Lenovo announces new Android tablets
2013-02-27
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MWC 2013: MediaTek to launch new chips for TD-SCDMA phones and tablets in 1H13
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Sony's Xperia Z smartphone off to a good start: executive
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HP says more tablets coming as it puts past distractions behind
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Intel's big push on mobile: Clover Trail+, 4G LTE modem
2013-02-27
Asustek aims at third largest market share for notebooks, tablets in Spain and Portugal in 2013
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MWC 2013: Nokia launches four new mobile phones
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New Qualcomm mobile chip to use TSMC 28HPM process

 

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Update: 11-10 01:02,Data has delay
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