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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
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2009-12-25
DRAM to fall into shortage in 2010
2009-12-25
Unexpected price rally at DRAM spot market, says inSpectrum
2009-12-25
ChipMOS loses DRAM packaging patent lawsuit against Walton
2009-12-24
Powerchip’s board approves debt repayment plans
2009-12-24
Quake costs TSMC half day of production
2009-12-24
Rexchip to ramp 40nm-class DRAM production in 2Q10, says Elpida
2009-12-24
IC distributor PCT optimistic about revenue growth in 2010
2009-12-24
Memory segment to fall by less than overall chip revenues in 2009, says Gartner
2009-12-24
InnoDisk intros 2TB PCIe SSD
2009-12-24
DRAM capex to hike 80% in 2010
2009-12-23
Intel, Micron seek to regain NAND process lead
2009-12-23
SMIC considers giving up two fabs, says paper
2009-12-23
Memory IC backend firm UTAC expects strong 4Q09, flat 1Q10
2009-12-23
USB 3.0 controller chip price cut to below US$3, say IC distributors

 

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Update: 11-13 12:50,Data has delay
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SK Hynix KRW 613000 -0.65%
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Micron USD 244.900 +1.57%
WDC USD 166.110 -2.28%
SanDisk USD 283.100 +4.24%
Nanya TWD 161.0 -1.23%
Winbond TWD 62.7 -3.24%
Phison TWD 1290 -1.90%
SMI USD 91.260 -2.09%
Maxio CNY 55.70 +3.22%
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Longsys CNY 326.02 +5.17%
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