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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2010-12-17
Intel, Micron to ramp delayed fab in 2Q11
2010-12-16
NAND flash contract prices to rise through 1Q11
2010-12-16
Chip equipment spending to slip 1% in 2011, says Gartner
2010-12-15
Zenitron points to touch panel IC and USB 3.0 as main growth drivers in 2011
2010-12-15
DRAM module makers 4Q10 profits likely hurt by rising NT dollar
2010-12-15
Memory packaging house reports November results
2010-12-14
Rexchip lowers capex for 2011
2010-12-13
DDR3 contract prices continue slide in 1H December
2010-12-13
MicroSD card controller orders buoy Skymedi sales in November
2010-12-13
NAND flash spot prices up after Toshiba power outage
2010-12-10
Phison, 3S November revenues down slightly on-month
2010-12-09
Winbond November sales up slightly on-month
2010-12-09
Intel loses 2010 chip market share while Samsung gains, says Gartner
2010-12-09
ProMOS, Rexchip November revenues slide
2010-12-09
Toshiba Says NAND Shipments May Fall on Power Outage

 

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Stock Information
Update: 11-19 03:35,Data has delay
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SK Hynix KRW 570000 -5.94%
KIOXIA JPY 10260 -8.11%
Micron USD 231.410 -4.36%
WDC USD 154.520 -4.88%
SanDisk USD 248.086 -6.69%
Nanya TWD 160.5 -3.60%
Winbond TWD 61.4 -7.25%
Phison TWD 1195 -7.36%
SMI USD 84.985 -0.57%
Maxio CNY 49.88 -0.83%
ASolid TWD 71.0 -6.58%
Longsys CNY 271.03 -5.80%
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