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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2010-08-27
Weak PC sales further drag down DRAM contract pricing in 2H August
2010-08-26
Smart memory chips may replace TCAMs, DRAMs
2010-08-25
Honeymoon ends early for Taiwan NOR flash suppliers
2010-08-25
Winbond adopts SpringSoft Laker for mobile memory
2010-08-24
Intel announces dual-core Atom CPU for netbooks
2010-08-23
KYEC Thailin 2Q10 profits climb
2010-08-23
More module makers clear NAND flash inventory to channels
2010-08-23
Samsung expands lead in 2Q10 DRAM market
2010-08-20
DRAM maker Powerchip raises capex for 2010
2010-08-20
US$1 per GB NAND may not resuscitate SSD
2010-08-20
Phison aims to be among global top-2 NAND device controller IC suppliers
2010-08-19
Phison gives gloomy outlook for NAND flash prices
2010-08-18
Chip backend firms to see revenues rebound in August
2010-08-18
Intel Micron sampling 25nm 3-bit-per-cell NAND
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Kingston to supply embedded NAND devices for HTC

 

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Update: 11-18 16:20,Data has delay
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